The **ATS-01D-86-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** heat sink designed for semiconductor cooling. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01D-86-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 15.90°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | XCUT (Cross-cut) | --- ### 2. Design Features The "C3" in the part number indicates a specific hardware configuration and material grade tailored for efficiency in forced-air environments. * **XCUT Fin Profile:** The fins are designed with a cross-cut pattern. This allows for multi-directional airflow, making it ideal for systems where the direction of the fan exhaust might vary or be turbulent. * **pushPIN™ Attachment:** This model uses a tool-free mounting system. It utilizes a brass or plastic pin with a stainless steel spring to provide precise pressure (TIM - Thermal Interface Material compression) on the chip, ensuring maximum heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease to simplify the assembly process on the PCB. --- ### 3. Application Use Cases This heat sink is sized for medium-sized electronic components that generate moderate heat loads. Common applications include: 1. **Processors & FPGAs:** Cooling small form-factor CPUs or Field Programmable Gate Arrays. 2. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. 3. **Telecommunications:** Used in routers and switches where high-density component placement requires efficient vertical cooling. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.90 | | 300 (1.5 m/s) | 4.60 | | 500 (2.5 m/s) | 2.80 |