The **ATS-01D-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring-loaded) | | **Dimensions** | 35mm x 35mm x 20mm | | **Thermal Resistance** | 13.30°C/W (Unducted Flow @ 100 LFM) | | **Airflow Path** | Straight (Straight Fin) | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (Straight Fin) The core of the part is the aluminum body featuring vertical straight fins. In electronics, the surface area is critical; the straight fin design maximizes the area for heat to transfer from the metal to the surrounding air, preventing "thermal throttling" or component failure. #### 2. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this part uses a mechanical push-pin system. This is crucial for electronic PCB (Printed Circuit Board) design because: * **Constant Pressure:** The compression springs provide precise, uniform pressure across the thermal interface material (TIM). * **Reliability:** It ensures the heat sink remains attached during mechanical shocks or vibrations. * **Pre-drilled Holes:** It requires specific hole patterns on the PCB (typically 35mm or 40mm spacing for this series). #### 3. Thermal Interface Material (TIM) The "C3" in the part number often indicates the type of thermal interface. This is a thin layer of conductive material pre-applied to the base of the heat sink. It fills microscopic air gaps between the heat sink and the electronic chip, significantly improving heat conduction. --- ### Thermal Performance Table Thermal resistance indicates how effectively the part removes heat. Lower values (measured in °C/W) are better as airflow increases. | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 4.80 °C/W | 13.30 °C/W | | 300 | 1.5 | 2.50 °C/W | 4.70 °C/W | | 500 | 2.5 | 1.90 °C/W | 3.00 °C/W |