The **ATS-01D-91-C1-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Thermal Resistance (Unducted)** | 21.86 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.58 °C/W @ 100 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Breakdown The part consists of four main electronic packaging sub-components: #### A. The Heat Sink Body * **Geometry:** Features a "Fine Pitch" design. This maximizes surface area for heat dissipation while maintaining a low profile (10mm height), making it ideal for tight PCB layouts. * **Material:** Extruded aluminum provides a high thermal conductivity-to-weight ratio. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or weak tapes, this part uses a mechanical spring-loaded pin system. * **Vibration Resistance:** The springs ensure constant pressure between the heat sink and the chip, which is critical for industrial or automotive electronics where vibration is present. * **Serviceability:** Allows for easy removal and reattachment during PCB debugging or repair. #### C. Thermal Interface Material (TIM) * The **T766** material is pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic component (CPU, GPU, or FPGA), significantly reducing thermal resistance at the contact point. #### D. Blue Anodized Finish * **Function:** Beyond aesthetics, the anodized coating provides electrical insulation and improves surface emissivity, aiding in heat radiation. --- ### 3. Application Use Cases This part is commonly used to cool the following types of electronic components: * **FPGAs & ASICs:** High-density logic chips that generate localized hotspots. * **Voltage Regulator Modules (VRMs):** Power delivery components that require stable thermal environments. * **Embedded Systems:** Industrial PCs where vertical space (10mm) is restricted. ---