The **ATS-01D-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling processors and other high-heat surface-mount components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 12.04°C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | --- ### 2. Key Electronic & Mechanical Parts The assembly is comprised of four main elements that work together to dissipate heat from electronic integrated circuits (ICs): #### A. The Heat Sink Body (Straight Fin) * **Function:** Conducts heat away from the semiconductor die. * **Design:** The straight-fin design is optimized for **undirectional airflow**, meaning it works best when the cooling fan blows air parallel to the fins. * **Material:** Made of high-grade aluminum for a balance between thermal conductivity and weight. #### B. The Push-Pin Mechanism * **Function:** Secures the heat sink to the Printed Circuit Board (PCB). * **Material:** Brass with a plastic or metal tip. * **Benefit:** These pins go through pre-drilled holes in the PCB, providing a consistent "clamping force" that ensures the heat sink remains in contact with the chip even during vibration. #### C. The Compression Spring * **Function:** Applies precise downward pressure. * **Importance:** Proper pressure is critical to minimizing the **Thermal Interface Resistance** between the heat sink and the electronic component. #### D. Thermal Interface Material (TIM) * The "R0" designation usually indicates that the unit comes with a **Pre-applied Thermal Tape** or Phase Change Material. * This fills the microscopic air gaps between the chip and the aluminum base to maximize heat transfer. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the air velocity (measured in Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Low)** | 12.04 | | **300 (Medium)** | 5.21 | | **500 (High)** | 3.82 | --- ### 4. Typical Applications * **Processors:** Cooling CPUs, GPUs, or FPGAs. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling MOSFETs or power transistors. * **Embedded Systems:** Industrial PCs where space is limited (10mm height).