The **ATS-01E-07-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 12.7mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 17.00°C/W (at 200 LFM) | | **Fin Style** | Straight (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This electronic cooling part is engineered for efficiency and ease of integration: * **Heat Sink Profile:** It features a low-profile design (12.7mm height), making it ideal for systems with limited vertical clearance. * **Fin Geometry:** The straight-fin design allows for multi-directional airflow, which is crucial in dense PCB environments where air might not flow in a single predictable path. * **Attachment Mechanism:** The "Push-Pin" system provides a secure mechanical attachment to the PCB. This is more reliable than adhesive-based thermal tapes, as it maintains consistent pressure (clamping force) over the lifetime of the product. * **Thermal Interface:** It comes with pre-applied **T766** thermal grease, which ensures low thermal resistance at the interface between the silicon die and the aluminum base. --- ### 3. Typical Applications The ATS-01E-07-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** For industrial PCs where space is constrained. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 4. **Computing:** Chipset cooling on motherboards.