The part number **ATS-01E-124-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed for cooling electronic components such as BGA (Ball Grid Array) packages. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ / superGRIP | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W)** | 50mm x 50mm | | **Height (Height Off Base)** | 25mm | | **Thermal Resistance (Flow)** | 1.10°C/W @ 200 LFM | | **Thermal Resistance (Static)** | 3.25°C/W @ Ducted flow | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the construction and materials: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01E:** Specific series/form factor designation. * **124:** Dimensional code (representing the 50x50mm footprint). * **C2:** Material/Finish code (typically indicates Aluminum with a specific Blue Anodize). * **R0:** Revision or packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is a mechanical component, its role in an electronic system is critical for hardware stability: 1. **Thermal Management:** It dissipates heat generated by high-power semiconductors (CPUs, GPUs, FPGAs, or ASICs) into the surrounding air. 2. **Performance Throttling Prevention:** By keeping the junction temperature low, it prevents the electronic component from entering "thermal throttle" mode, maintaining high clock speeds. 3. **Longevity:** Excessive heat is the primary cause of semiconductor failure; this part extends the Mean Time Between Failures (MTBF) of the PCB assembly. --- ### 4. Installation Mechanism The **push-pin** attachment system consists of: * **Compression Springs:** Provide precise vertical pressure to ensure maximum contact between the heat sink base and the chip. * **Interface Material:** Usually paired with a Thermal Interface Material (TIM) like thermal paste or a phase-change pad to fill microscopic air gaps.