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  • ATS-01E-34-C2-R0

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    The **ATS-01E-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table highlights the core technical data for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Product Category** | Heat Sinks | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 6.73°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 57.15mm x 57.15mm x 25.00mm | | **Fin Style** | Straight (Vertical) | --- ### 2. Key Electronic Features #### A. Thermal Efficiency The primary function of this part is to dissipate heat from electronic components (like CPUs, FPGAs, or Power MOSFETs). * **Low Airflow Performance:** It is optimized for natural convection or low-velocity forced air. * **Thermal Interface Material (TIM):** This specific model typically features **T766** pre-applied phase-change material, which improves the heat transfer between the chip and the aluminum base by filling microscopic air gaps. #### B. Mechanical Attachment (Push Pin) Unlike adhesive-based heat sinks, the ATS-01E-34-C2-R0 uses a **Push Pin with a compression spring**. * **Pressure Consistency:** The spring ensures constant pressure on the electronic component, preventing the heat sink from shifting during vibration or thermal expansion. * **Hole Pattern:** It requires specific pre-drilled holes in the PCB (Printed Circuit Board) for installation. #### C. Material Properties * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** Not just for aesthetics; the anodized layer provides electrical insulation and increases the surface emissivity, slightly improving radiant heat transfer. --- ### 3. Applications This heat sink is commonly found in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Power Supplies:** Managing heat in high-efficiency DC-DC converters. 3. **Industrial Controls:** Protecting processors in high-temperature environments.
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized heat sinks regarding thermal performance?
    • ⤷ How do I calculate if the 6.73°C/W thermal resistance is sufficient for my specific IC?
    • ⤷ Does this model come with different spring tensions for sensitive PCBs?