ATS-01E-34-C2-R0
AI

The **ATS-01E-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling semiconductors and integrated circuits (ICs).
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### 1. Technical Specifications
The following table highlights the core technical data for this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Product Category** | Heat Sinks |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Brass) |
| **Thermal Resistance** | 6.73°C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 57.15mm x 57.15mm x 25.00mm |
| **Fin Style** | Straight (Vertical) |
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### 2. Key Electronic Features
#### A. Thermal Efficiency
The primary function of this part is to dissipate heat from electronic components (like CPUs, FPGAs, or Power MOSFETs).
* **Low Airflow Performance:** It is optimized for natural convection or low-velocity forced air.
* **Thermal Interface Material (TIM):** This specific model typically features **T766** pre-applied phase-change material, which improves the heat transfer between the chip and the aluminum base by filling microscopic air gaps.
#### B. Mechanical Attachment (Push Pin)
Unlike adhesive-based heat sinks, the ATS-01E-34-C2-R0 uses a **Push Pin with a compression spring**.
* **Pressure Consistency:** The spring ensures constant pressure on the electronic component, preventing the heat sink from shifting during vibration or thermal expansion.
* **Hole Pattern:** It requires specific pre-drilled holes in the PCB (Printed Circuit Board) for installation.
#### C. Material Properties
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodization:** Not just for aesthetics; the anodized layer provides electrical insulation and increases the surface emissivity, slightly improving radiant heat transfer.
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### 3. Applications
This heat sink is commonly found in:
1. **Telecommunications:** Cooling network switches and routers.
2. **Power Supplies:** Managing heat in high-efficiency DC-DC converters.
3. **Industrial Controls:** Protecting processors in high-temperature environments.
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What is the difference between blue anodized and black anodized heat sinks regarding thermal performance?
- ⤷ How do I calculate if the 6.73°C/W thermal resistance is sufficient for my specific IC?
- ⤷ Does this model come with different spring tensions for sensitive PCBs?