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  • ATS-01E-36-C2-R0

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    The **ATS-01E-36-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "blue ICE" series designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages. ### 1. Technical Specifications Below are the primary physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Length x Width** | 36.83mm x 36.83mm | | **Height** | 12.7mm | | **Thermal Resistance** | 14.82°C/W (at 200 LFM) | | **Flow Orientation** | Vertical Fin (Cross-Cut) | --- ### 2. Key Component Features #### A. Cross-Cut Fin Design Unlike straight-fin heat sinks, this model features a **cross-cut** pattern. This allows for multi-directional airflow, making it ideal for systems where the airflow direction is unpredictable or obstructed by other components on the PCB. #### B. Push-Pin Attachment The "R0" suffix indicates a specific attachment kit. * **Mechanism:** It uses a plastic push-pin with a compression spring. * **Benefit:** This provides a secure, consistent downward force (pressure) onto the electronic chip, ensuring better contact with the thermal interface material (TIM). * **PCB Mounting:** Requires pre-drilled holes in the motherboard or PCB. #### C. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied thermal pad or require high-conductivity grease to bridge the microscopic air gaps between the chip and the aluminum base. --- ### 3. Application Use Cases This specific size and thermal profile are commonly used for: * **CPUs/GPUs:** In embedded or low-power industrial systems. * **FPGAs:** Cooling logic gate arrays in telecommunications equipment. * **ASICs:** Specialized chips in networking hardware (switches/routers). --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 14.82 | | 300 | 8.30 | | 400 | 6.30 | | 500 | 5.30 |
    ✨ Follow-up Questions
    • ⤷ What is the hole diameter required for the push-pin mounting on the PCB?
    • ⤷ Does this model come with pre-applied thermal interface material?
    • ⤷ How does 'Blue Anodizing' affect the thermal performance compared to bare aluminum?