ATS-01E-36-C2-R0
AI

The **ATS-01E-36-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "blue ICE" series designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages.
### 1. Technical Specifications
Below are the primary physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Length x Width** | 36.83mm x 36.83mm |
| **Height** | 12.7mm |
| **Thermal Resistance** | 14.82°C/W (at 200 LFM) |
| **Flow Orientation** | Vertical Fin (Cross-Cut) |
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### 2. Key Component Features
#### A. Cross-Cut Fin Design
Unlike straight-fin heat sinks, this model features a **cross-cut** pattern. This allows for multi-directional airflow, making it ideal for systems where the airflow direction is unpredictable or obstructed by other components on the PCB.
#### B. Push-Pin Attachment
The "R0" suffix indicates a specific attachment kit.
* **Mechanism:** It uses a plastic push-pin with a compression spring.
* **Benefit:** This provides a secure, consistent downward force (pressure) onto the electronic chip, ensuring better contact with the thermal interface material (TIM).
* **PCB Mounting:** Requires pre-drilled holes in the motherboard or PCB.
#### C. Thermal Interface Material (TIM)
Usually, these parts come with a pre-applied thermal pad or require high-conductivity grease to bridge the microscopic air gaps between the chip and the aluminum base.
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### 3. Application Use Cases
This specific size and thermal profile are commonly used for:
* **CPUs/GPUs:** In embedded or low-power industrial systems.
* **FPGAs:** Cooling logic gate arrays in telecommunications equipment.
* **ASICs:** Specialized chips in networking hardware (switches/routers).
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### 4. Thermal Performance Data
Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 14.82 |
| 300 | 8.30 |
| 400 | 6.30 |
| 500 | 5.30 |
- ⤷
What is the hole diameter required for the push-pin mounting on the PCB?
- ⤷ Does this model come with pre-applied thermal interface material?
- ⤷ How does 'Blue Anodizing' affect the thermal performance compared to bare aluminum?