The **ATS-01E-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "superGRIP" series, designed for high-airflow environments and precision cooling. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | 6.57°C/W @ 200 LFM | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight (Vertical) | --- ### 2. Design Breakdown The "electronic parts" of this assembly are focused on the efficient dissipation of heat from integrated circuits (ICs) or BGA (Ball Grid Array) components: * **Heat Sink Body:** Constructed from aluminum for its high thermal conductivity-to-weight ratio. The blue anodized finish increases emissivity and provides corrosion resistance. * **Fin Configuration:** The straight-cut fins are optimized for **forced convection** (air moving through a fan). They provide a large surface area for heat to transfer from the metal to the passing air. * **The superGRIP™ Attachment:** * **Plastic Frame:** A high-strength clip that snaps onto the PCB without requiring holes. * **Metal Spring:** A "horseshoe" shaped spring clip that applies uniform pressure across the component. * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied high-performance thermal pad (often Phase Change Material) on the base to fill microscopic air gaps between the chip and the heat sink. --- ### 3. Part Number Decoding Understanding the nomenclature helps identify the specific variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01E** | Series (superGRIP Thermal Management) | | **47** | Specific physical dimensions/footprint | | **C2** | Thermal Performance/Fin Density code | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Use-Cases This component is typically used in industrial and telecommunications hardware where PCB space is limited but heat generation is high: * **Network Switches/Routers:** Cooling high-speed processors. * **FPGA/ASIC:** Providing thermal stability for custom logic chips. * **Power Supplies:** Managing heat for MOSFETs or power regulators.