ATS-01E-53-C2-R0
AI

The **ATS-01E-53-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part is part of the **blueICE™** series and is designed for the thermal management of electronic components, particularly Integrated Circuits (ICs) and Ball Grid Arrays (BGAs).
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-01E-53-C2-R0 |
| **Heat Sink Type** | Push-Pin Mount (standard attachment) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 30.00mm |
| **Thermal Resistance** | ~2.0°C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
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### Key Electronic & Mechanical Components
#### 1. Thermal Interface Material (TIM)
The "R0" suffix often indicates the inclusion of a high-performance **Thermal Interface Material**. This is a pre-applied phase-change material or adhesive pad that sits between the component (CPU/GPU) and the aluminum base to fill microscopic air gaps, ensuring maximum heat transfer.
#### 2. Push-Pin Attachment Mechanism
Instead of using messy thermal glues, this part utilizes a **brass push-pin** system with a compression spring.
* **Purpose:** Provides consistent pressure (clamping force) on the electronic chip.
* **Benefit:** Prevents the heat sink from shifting during vibration or shipping, and allows for easier maintenance/removal compared to epoxy.
#### 3. Fin Geometry (Straight Fin)
The straight-fin design is optimized for **forced air cooling** (active cooling with fans). The vertical channels allow air to pass through with low pressure drop, making it efficient for high-density PCB environments.
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### Applications in Electronics
This component is typically found in the following electronic systems:
* **Networking Equipment:** Routers, switches, and high-speed modems.
* **Embedded Computing:** Industrial motherboards and Single Board Computers (SBCs).
* **Power Supplies:** Cooling MOSFETs or power regulators.
* **Telecommunications:** Base station hardware where reliability under heat is critical.
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- ⤷
What is the difference between push-pin and clip-on mounting for this heat sink?
- ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used for passive cooling without a fan?