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  • ATS-01E-53-C2-R0

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    The **ATS-01E-53-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part is part of the **blueICE™** series and is designed for the thermal management of electronic components, particularly Integrated Circuits (ICs) and Ball Grid Arrays (BGAs). --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01E-53-C2-R0 | | **Heat Sink Type** | Push-Pin Mount (standard attachment) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 30.00mm | | **Thermal Resistance** | ~2.0°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### Key Electronic & Mechanical Components #### 1. Thermal Interface Material (TIM) The "R0" suffix often indicates the inclusion of a high-performance **Thermal Interface Material**. This is a pre-applied phase-change material or adhesive pad that sits between the component (CPU/GPU) and the aluminum base to fill microscopic air gaps, ensuring maximum heat transfer. #### 2. Push-Pin Attachment Mechanism Instead of using messy thermal glues, this part utilizes a **brass push-pin** system with a compression spring. * **Purpose:** Provides consistent pressure (clamping force) on the electronic chip. * **Benefit:** Prevents the heat sink from shifting during vibration or shipping, and allows for easier maintenance/removal compared to epoxy. #### 3. Fin Geometry (Straight Fin) The straight-fin design is optimized for **forced air cooling** (active cooling with fans). The vertical channels allow air to pass through with low pressure drop, making it efficient for high-density PCB environments. --- ### Applications in Electronics This component is typically found in the following electronic systems: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Computing:** Industrial motherboards and Single Board Computers (SBCs). * **Power Supplies:** Cooling MOSFETs or power regulators. * **Telecommunications:** Base station hardware where reliability under heat is critical. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and clip-on mounting for this heat sink?
    • ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used for passive cooling without a fan?