ATS-01E-63-C2-R0
AI

The **ATS-01E-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs).
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Fin Type** | Straight |
| **Fin Pattern** | Square-Cut |
| **Attachment Method** | pushPIN™ |
| **Dimension (Length x Width)** | 40.00 mm x 40.00 mm |
| **Height** | 20.00 mm |
| **Thermal Resistance (Unducted)** | 12.32 °C/W @ 100 LFM |
| **Finish** | Blue Anodized |
| **Interface Material** | T766 (Thermal Tape) |
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### 2. Key Component Features
#### A. pushPIN™ Attachment System
Unlike standard adhesive-only heat sinks, this part uses a **pushPIN™** system. This consists of:
* **Compression Springs:** Provide precise, consistent pressure across the interface to maximize heat transfer.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB.
#### B. Thermal Performance
The "Square-Cut" design allows for multi-directional airflow. This is critical in dense electronic enclosures where airflow might not be perfectly linear. The **T766 thermal interface material (TIM)** is pre-applied to the base, ensuring a low thermal resistance path between the component (CPU/GPU/FPGA) and the heat sink.
#### C. Material Science
The use of **Aluminum 6063** provides a high strength-to-weight ratio and excellent thermal conductivity (approx. 200 W/m·K). The **Blue Anodized** finish isn't just aesthetic; it increases surface emissivity and provides corrosion resistance.
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### 3. Application Use Cases
This specific model is commonly found in:
* **Telecommunications:** Cooling of high-speed networking chips.
* **Industrial PCs:** Heat dissipation for embedded processors.
* **Power Supplies:** Cooling MOSFETs or power transistors.
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What are the mechanical requirements for the PCB holes to mount this pushPIN heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used in a passive cooling environment without fans?