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  • ATS-01E-63-C2-R0

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    The **ATS-01E-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Fin Type** | Straight | | **Fin Pattern** | Square-Cut | | **Attachment Method** | pushPIN™ | | **Dimension (Length x Width)** | 40.00 mm x 40.00 mm | | **Height** | 20.00 mm | | **Thermal Resistance (Unducted)** | 12.32 °C/W @ 100 LFM | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System Unlike standard adhesive-only heat sinks, this part uses a **pushPIN™** system. This consists of: * **Compression Springs:** Provide precise, consistent pressure across the interface to maximize heat transfer. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### B. Thermal Performance The "Square-Cut" design allows for multi-directional airflow. This is critical in dense electronic enclosures where airflow might not be perfectly linear. The **T766 thermal interface material (TIM)** is pre-applied to the base, ensuring a low thermal resistance path between the component (CPU/GPU/FPGA) and the heat sink. #### C. Material Science The use of **Aluminum 6063** provides a high strength-to-weight ratio and excellent thermal conductivity (approx. 200 W/m·K). The **Blue Anodized** finish isn't just aesthetic; it increases surface emissivity and provides corrosion resistance. --- ### 3. Application Use Cases This specific model is commonly found in: * **Telecommunications:** Cooling of high-speed networking chips. * **Industrial PCs:** Heat dissipation for embedded processors. * **Power Supplies:** Cooling MOSFETs or power transistors.
    ✨ Follow-up Questions
    • ⤷ What are the mechanical requirements for the PCB holes to mount this pushPIN heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in a passive cooling environment without fans?