The **ATS-01E-69-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "Blue Anodized" series designed for effective thermal management in electronic components. --- ### 1. Technical Specifications The following table highlights the primary mechanical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Number of Fins** | Variable (Push-Pin style) | | **Thermal Resistance** | ~11.0°C/W (Natural Convection) | --- ### 2. Key Components & Design The part consists of several integrated electronic cooling elements: #### A. The Heat Sink Body * **Material:** High-grade aluminum provides a balance between thermal conductivity and weight. * **Geometry:** The "69" series typically features a straight-fin or cross-cut design to maximize surface area, allowing heat to dissipate from the component to the ambient air. #### B. The Attachment Mechanism (Push-Pin) * The **"R0"** designation refers to the specific attachment kit. * It utilizes plastic push-pins with internal springs. This ensures a consistent **compression force** against the heat source (like a CPU, FPGA, or GPU), which is critical for minimizing thermal contact resistance. #### C. Thermal Interface Material (TIM) * These units often come with a pre-applied high-performance thermal pad or grease on the bottom surface. This fills the microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Application Use Cases This specific model is commonly used for cooling: 1. **Processors:** Mid-range CPUs or microcontrollers. 2. **FPGAs/ASICs:** Field Programmable Gate Arrays that generate significant heat during high-speed data processing. 3. **Power Electronics:** Integrated circuits in power supplies or motor controllers. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer). * **01E:** Specific series designation. * **69:** Indicates the physical size/footprint (45mm x 45mm). * **C2:** Refers to the thermal performance/fin configuration. * **R0:** Standard hardware/attachment configuration.