The **ATS-01E-75-C1-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "blue ice" or high-efficiency push-pin series. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-01E-75-C1-R0 | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | ~14.95°C/W (Natural Convection) | --- ### 2. Breakdown of the Part Number The alphanumeric code identifies the specific configuration of the cooling solution: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **01E**: Designates the specific series/profile of the heatsink. * **75**: Relates to the specific height and fin density configuration. * **C1**: Indicates the thermal interface material (TIM) used. "C1" typically refers to **ATS-54**, a high-performance thermal phase-change material pre-applied to the base. * **R0**: Refers to the RoHS compliance status and revision level. --- ### 3. Key Electronic Features * **Push-Pin Mounting**: Unlike adhesive-based heatsinks, this uses a spring-loaded push-pin mechanism. This provides consistent pressure (load) on the electronic component (CPU, GPU, or FPGA), which improves heat transfer efficiency. * **Pre-Applied TIM**: It comes with a "chomerics" or similar thermal pad/grease pre-applied. This simplifies the assembly process in PCB manufacturing. * **Optimized Airflow**: The straight-fin design is optimized for environments with consistent directional airflow (forced induction). * **Material Efficiency**: The use of 6063 aluminum provides a balance between lightweight design and high thermal conductivity. --- ### 4. Typical Applications This part is commonly found in the following electronic systems: 1. **Telecommunications**: Cooling for high-speed routers and switches. 2. **Embedded Computing**: Managing thermals for industrial SBCs (Single Board Computers). 3. **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators. 4. **Edge AI**: Cooling small-form-factor processing units.