The **ATS-01E-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 6.96°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | --- ### 2. Key Components & Design Features #### A. Fin Design (Straight Fin) The "84" in the part number refers to the specific fin configuration. This model typically features a **Straight Fin** geometry. This design is optimized for environments where there is a consistent, directional airflow (forced convection). #### B. The pushPIN™ Attachment System This heat sink uses a proprietary push-pin mechanism. This is critical for electronic assembly because: * **Constant Pressure:** It ensures the heat sink is pressed firmly against the electronic component for maximum heat transfer. * **Ease of Installation:** It allows for quick assembly on a PCB without the need for specialized tools. * **Secure Fit:** The springs prevent the heat sink from shifting due to mechanical vibration. #### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The anodization layer provides corrosion resistance and improves thermal emissivity, which helps slightly with radiation cooling. --- ### 3. Application Use Cases This specific heat sink is typically found in the following electronic sectors: * **Telecommunications:** Cooling small-form-factor networking chips. * **Embedded Systems:** Dissipating heat from microprocessors on industrial motherboards. * **Power Electronics:** Managing heat for voltage regulators or high-speed memory modules. --- ### 4. Thermal Performance Comparison The efficiency of the ATS-01E-84-C2-R0 is highly dependent on Airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.96 | | 300 (1.5 m/s) | 2.46 | | 500 (2.5 m/s) | 1.80 |