The **ATS-01E-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, which is designed to provide high-efficiency cooling for electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Mounting Style** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance** | 8.98°C/W (at 200 LFM) | | **Attachment Method** | Plastic Push Pin with Brass Springs | | **Flow Pattern** | maxiFLOW™ (Optimized for directional airflow) | --- ### 2. Key Component Features #### A. The maxiFLOW™ Design Unlike standard straight-fin heat sinks, the ATS-01E-85-C2-R0 features a **flared fin structure**. This geometry: * Increases the surface area for heat dissipation. * Reduces the pressure drop across the sink, allowing air to flow through it more easily. * Is ideal for systems with high-density components where airflow is restricted. #### B. pushPIN™ Attachment System The part utilizes the patented **pushPIN™** assembly. This is critical for electronics because: * It ensures consistent pressure (clamping force) on the electronic chip, which optimizes thermal interface material (TIM) performance. * The hardware is pre-assembled, reducing the risk of component damage during installation. * It includes a compression spring that accounts for PCB thickness variations. #### C. Thermal Interface Material (TIM) Typically, these units come with a pre-applied thermal interface material (like **T766**), which fills microscopic air gaps between the heat sink and the electronic chip to ensure maximum heat transfer. --- ### 3. Application Use Cases This specific heat sink size (35mm x 35mm) is commonly used for cooling: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Dissipating heat from MOSFETs or Power ICs. 3. **Embedded Systems:** Industrial PCs or automation controllers where passive or forced-air cooling is required. ---