The **ATS-01E-93-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series and is designed for high-performance thermal management. --- ### 1. Component Overview The ATS-01E-93-C2-R0 is a **Heatsink** designed primarily for cooling BGA (Ball Grid Array) components and other high-heat surface-mount integrated circuits. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Type** | Board Level Heatsink | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance planning. * **Size:** 40mm x 40mm (Square base). * **Height:** 20mm (Standard low-profile). * **Fin Style:** Straight fin design optimized for high-velocity airflow. --- ### 3. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better heat dissipation. * **Thermal Resistance (Unducted @ 200 LFM):** Approximately 2.80 °C/W. * **Thermal Resistance (Ducted):** Performance improves significantly in channeled airflow environments. --- ### 4. Mounting System: pushPIN™ One of the defining features of this part is the attachment mechanism. 1. **Spring-Loaded Pins:** Uses two plastic or brass pins with springs to provide constant, even pressure on the chip. 2. **Reliability:** This method is preferred over thermal adhesives because it ensures a mechanical bond that survives shock and vibration. 3. **TIM (Thermal Interface Material):** Usually comes pre-applied with a high-performance thermal pad (T766 or similar) to fill microscopic air gaps between the chip and the heatsink. --- ### 5. Application Areas * **Networking:** Routers, switches, and base stations. * **Computing:** Embedded systems and industrial PCs. * **Power Supplies:** Cooling high-wattage voltage regulators.