The **ATS-01E-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series, designed for high-density cooling requirements. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Below is the technical breakdown: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 7.29°C/W (Natural Convection) | | **Thermal Interface Material (TIM)** | T766 (High Performance Pre-applied) | --- ### 2. Key Component Features #### A. Fin Geometry The "95" series typically features a **Straight Fin** or **Cross-Cut** design. This allows for optimal airflow in forced convection environments (where fans are used), significantly reducing the junction temperature of the semiconductor it is cooling. #### B. Attachment Mechanism: Push-Pins Unlike adhesive tapes, this part uses **Plastic Push-Pins**. * **Reliability:** Provides consistent pressure on the processor/chip. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). * **Compression Spring:** Ensures the TIM (Thermal Interface Material) makes a perfect seal between the heat sink and the component. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the unit comes pre-applied with **T766**. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the heat sink surface and the electronic chip to improve heat transfer. --- ### 3. Typical Applications This specific heat sink is used to cool integrated circuits (ICs) that generate significant heat, such as: * **FPGA & ASICs:** Used in networking and telecommunications equipment. * **Processors:** Embedded CPUs or GPUs in industrial computing. * **Power Modules:** High-efficiency power converters. --- ### 4. Dimensional Drawing Summary | Feature | Measurement | | :--- | :--- | | **Length (A)** | 40.00 mm | | **Width (B)** | 40.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (E)** | 33.00 mm (Distance between pins) |