The **ATS-01F-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40.00mm x 40.00mm | | **Height** | 12.70mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 18.32° C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (High-performance Phase Change) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical push-pin system. * **Reliability:** Provides constant pressure to ensure maximum surface contact between the chip and the heat sink. * **Versatility:** Available in different materials (plastic/brass) and spring strengths to meet specific vibration or shock requirements in industrial electronics. #### B. Thermal Performance The "C2" in the part number indicates a specific thermal profile. As airflow (LFM - Linear Feet per Minute) increases, the resistance drops significantly: * **@100 LFM:** 18.32° C/W * **@700 LFM:** 4.12° C/W #### C. Fine-Pitch Fin Design The heat sink features a high-density fin structure. This maximizes surface area within a small footprint, allowing for superior heat dissipation in compact electronic enclosures where space is limited. --- ### 3. Applications This part is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Consumer Electronics:** High-speed data processing units. ---