ATS-01F-02-C3-R0
AI

The **ATS-01F-02-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in compact electronic systems.
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### 1. Technical Specifications
The following table summarizes the core physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm |
| **Thermal Resistance (Unducted)** | 18.25 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 2.80 °C/W @ 100 LFM |
| **Pitch** | Fine Pitch |
| **Pattern** | XC (Cross-Cut) |
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### 2. Design and Engineering Features
* **Cross-Cut (XC) Fin Design:** This heat sink uses a cross-cut pattern which increases surface area and allows for omnidirectional airflow. This makes it ideal for systems where the direction of the fan intake might vary.
* **PushPIN™ Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical push-pin system. This ensures consistent pressure across the interface for optimal thermal transfer and allows for easy removal/rework.
* **AL6063 Aluminum:** This specific grade of aluminum offers a high thermal conductivity-to-weight ratio, ensuring the component is lightweight but effective at pulling heat away from the semiconductor.
* **Thermal Interface Material (TIM):** The part typically comes with pre-applied **T412** thermal grease or similar, which fills microscopic air gaps between the heat source and the heat sink.
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### 3. Applications
The ATS-01F-02-C3-R0 is commonly used to cool the following types of electronic components:
1. **CPUs / GPUs:** Low-power or mobile processors.
2. **FPGAs:** Field Programmable Gate Arrays that generate significant localized heat.
3. **Power MOSFETs:** High-speed switching components in power supplies.
4. **Telecommunications Equipment:** Routers and switches where vertical space is limited (15mm height).
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- ⤷
What are the advantages of push-pin mounting over thermal adhesive?
- ⤷ How does the 'Fine Pitch' fin design affect performance in low-airflow environments?
- ⤷ What are the specific dimensions of the mounting holes required for this part?