The **ATS-01F-05-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance "maxiFLOW™" series of heat sinks designed for cooling integrated circuits and power components. --- ### Technical Specifications The following table summarizes the primary physical and thermal properties of this part: | Characteristic | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Thermal Resistance** | 2.15 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### Key Features and Functionality #### 1. Thermal Design (maxiFLOW™) The "maxiFLOW" geometry features a spread fin structure. Unlike standard square fin heat sinks, these fins flare outward, which increases the surface area and reduces pressure drop. This allows for maximum airflow through the sink, significantly improving cooling efficiency in constrained spaces. #### 2. Attachment System (pushPIN™) The part utilizes the proprietary **pushPIN™** attachment mechanism. - It uses a flexible spring-loaded pin that passes through pre-drilled holes in the PCB. - This provides a consistent, secure attachment force, ensuring the thermal interface material (TIM) remains in constant contact with the chip. #### 3. Thermal Interface Material (T412) The "C3" in the part number indicates the inclusion of **T412** thermal tape or grease. This material fills the microscopic air gaps between the heat sink base and the electronic component (CPU, GPU, or FPGA), facilitating efficient heat transfer. #### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides a thin protective coating that resists corrosion and slightly improves radiant heat emission. --- ### Common Applications This heat sink is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Industrial Power Supplies:** Dissipating heat from MOSFETs or IGBTs. * **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling.