The **ATS-01F-112-C2-R1** is not a complex electronic circuit component (like an IC or transistor) but rather a high-performance **Heat Sink** assembly manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueIce™** series and is specifically designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-01F-112-C2-R1 | | **Type** | Board Level, Square Fin Heat Sink | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 50mm x 50mm x 25mm | | **Thermal Resistance** | 0.80° C/W @ 200 LFM | | **Airflow** | Vertical / Directional | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Key Components & Construction #### A. The Fin Geometry This model uses a **Square Fin** (also known as a cross-cut or pin-fin) design. This allows for multi-directional airflow, making it highly effective in systems where the direction of the cooling air might be inconsistent or turbulent. #### B. Attachment Mechanism (Push-Pins) The "R1" suffix typically denotes the hardware configuration. It uses **Push-Pins** and springs: * **Plastic Push-Pins:** Used to secure the heat sink to the PCB through pre-drilled holes. * **Compression Springs:** Ensure even pressure across the electronic component to maximize heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Purpose:** Fills microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** Reduces contact resistance, allowing heat to flow more efficiently into the aluminum fins. --- ### 3. Application Use Cases This part is typically found in: 1. **Telecommunications:** Cooling signal processing boards. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Dissipating heat from high-current MOSFETs or Rectifiers. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how well the part cools. Lower values are better. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 0.80 | | 300 (1.5 m/s) | 0.67 | | 400 (2.0 m/s) | 0.58 | ---