ATS-01F-122-C2-R0
AI

The part number **ATS-01F-122-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component belongs to the "blue ICECUBE" or "push-pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 5.87°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm |
| **Fin Style** | Straight |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific logic used by ATS to identify the part's features:
- **ATS-01**: Indicates the series (Push-pin heat sink).
- **F**: Denotes the fin pattern/density.
- **122**: Represents the specific dimensions and hole pattern.
- **C2**: Refers to the thermal interface material (TIM) or specific coating (Blue Anodized).
- **R0**: Indicates the revision status (standard production).
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### 3. Key Electronic Functions
While a heat sink is a mechanical part, it is critical to the electronics for several reasons:
* **Thermal Management:** It increases the surface area of the heat-generating component (the IC), allowing the air to carry away heat more efficiently.
* **Reliability:** By keeping the junction temperature ($T_j$) low, it prevents thermal throttling and extends the lifespan of the semiconductor.
* **Ease of Assembly:** The use of push-pins and springs ensures consistent pressure across the surface of the chip, which is vital for the efficiency of the Thermal Interface Material (TIM).
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### 4. Component Comparison
| Feature | ATS-01F-122-C2-R0 | Standard Adhesive Heat Sink |
| :--- | :--- | :--- |
| **Mounting Security** | High (Mechanical Pins) | Moderate (Adhesive Tape) |
| **Reusability** | Yes (Pins can be removed) | No (Tape loses stickiness) |
| **Pressure** | Constant (Spring-loaded) | Variable |
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- ⤷
What is the hole-to-hole distance required on a PCB for this specific heat sink?
- ⤷ Does this model come with pre-applied thermal interface material (TIM)?
- ⤷ What are the airflow requirements to achieve the rated 5.87°C/W thermal resistance?