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  • ATS-01F-122-C2-R0

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    The part number **ATS-01F-122-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component belongs to the "blue ICECUBE" or "push-pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 5.87°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Fin Style** | Straight | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific logic used by ATS to identify the part's features: - **ATS-01**: Indicates the series (Push-pin heat sink). - **F**: Denotes the fin pattern/density. - **122**: Represents the specific dimensions and hole pattern. - **C2**: Refers to the thermal interface material (TIM) or specific coating (Blue Anodized). - **R0**: Indicates the revision status (standard production). --- ### 3. Key Electronic Functions While a heat sink is a mechanical part, it is critical to the electronics for several reasons: * **Thermal Management:** It increases the surface area of the heat-generating component (the IC), allowing the air to carry away heat more efficiently. * **Reliability:** By keeping the junction temperature ($T_j$) low, it prevents thermal throttling and extends the lifespan of the semiconductor. * **Ease of Assembly:** The use of push-pins and springs ensures consistent pressure across the surface of the chip, which is vital for the efficiency of the Thermal Interface Material (TIM). --- ### 4. Component Comparison | Feature | ATS-01F-122-C2-R0 | Standard Adhesive Heat Sink | | :--- | :--- | :--- | | **Mounting Security** | High (Mechanical Pins) | Moderate (Adhesive Tape) | | **Reusability** | Yes (Pins can be removed) | No (Tape loses stickiness) | | **Pressure** | Constant (Spring-loaded) | Variable | ---
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole distance required on a PCB for this specific heat sink?
    • ⤷ Does this model come with pre-applied thermal interface material (TIM)?
    • ⤷ What are the airflow requirements to achieve the rated 5.87°C/W thermal resistance?