The part number **ATS-01F-126-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01F-126-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 5.47°C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 54mm x 54mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Design and Components * **Heat Sink Body:** Constructed from high-grade aluminum. The 15mm height makes it a "low profile" solution, ideal for compact server racks or thin electronic enclosures. * **Fin Geometry:** It utilizes a **straight-fin** design. This is optimized for unidirectional airflow (forced convection), typically provided by a nearby system fan. * **Attachment (Push-Pins):** This model uses a tool-less attachment system. The plastic push-pins are designed to snap into pre-drilled holes on a PCB (Printed Circuit Board), ensuring a consistent pressure against the component. * **Integrated Spring:** Each push-pin usually includes a brass or steel spring to provide the necessary downward force (clamping pressure) to maximize thermal transfer. --- ### 3. Thermal Performance Analysis The efficiency of this heat sink depends heavily on the airflow (LFM) within the system. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM** | 5.47 | | **200 LFM** | 3.23 | | **300 LFM** | 2.50 | | **400 LFM** | 2.09 | --- ### 4. Key Features for Engineers 1. **Blue Anodized Finish:** Not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases emissivity for better heat radiation. 2. **Pre-applied TIM:** It comes with **T766 thermal interface material** already applied to the base. This ensures there are no air gaps between the chip and the heat sink, reducing "Contact Resistance." 3. **Lightweight:** Being aluminum, it places minimal mechanical stress on the PCB compared to copper alternatives.