The **ATS-01F-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like BGAs (Ball Grid Arrays) and CPUs. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 30.0mm | | **Thermal Resistance** | 3.60°C/W (at 200 LFM) | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Key Components & Materials To understand the "electronic parts" of this assembly, we look at the mechanical stack-up: * **Heat Sink Body:** Constructed from extruded aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** This chemical finish increases corrosion resistance and improves "emissivity," which slightly enhances heat radiation into the surrounding air. * **Push Pin Assembly:** * **Pins:** Usually made of brass or plastic; they lock the heat sink into pre-drilled holes on the PCB. * **Springs:** These provide a precise "clamping force" to ensure the heat sink makes constant, firm contact with the electronic chip. * **Thermal Interface Material (TIM):** The part number suffix `-R0` typically indicates the inclusion of a pre-applied thermal tape or phase-change material on the base to bridge the microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 6.96 | | **200 (1.0 m/s)** | 3.60 | | **400 (2.0 m/s)** | 2.42 | | **600 (3.0 m/s)** | 1.91 | --- ### 4. Application Use-Case This part is typically used in: 1. **Telecommunications:** Cooling signal processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where high-profile cooling (30mm height) is possible. 3. **Power Electronics:** Dissipating heat from high-speed FPGA or ASIC chips.