The **ATS-01F-134-C3-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling high-power electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 4.50°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Interface Material** | T412 (Thermal Tape) | | **Airflow Direction** | Vertical/Sideways (Optimized for fluted flow) | --- ### 2. Key Design Components #### A. The maxiFLOW™ Geometry The "F" in the part number indicates the maxiFLOW™ design. Unlike standard straight-fin heat sinks, this design features a **tapered fin structure**. - **Benefit:** It increases the surface area for heat dissipation while minimizing pressure drop across the device. - **Application:** Ideal for dense PCB layouts where airflow may be restricted. #### B. pushPIN™ Attachment The unit utilizes a specialized mechanical attachment system: - **Spring-Loaded Pins:** Provides consistent pressure on the electronic component (die), ensuring optimal thermal contact. - **Durability:** More secure than standard adhesive tapes, making it suitable for high-vibration environments. #### C. T412 Thermal Interface Material (TIM) The "C3" suffix denotes the specific thermal pad or tape pre-applied to the base. - **T412:** This is a high-performance thermal tape that facilitates heat transfer from the chip to the aluminum fins without the mess of thermal grease. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **01F** | Product Series (maxiFLOW™) | | **134** | Specific dimension/form factor code | | **C3** | Thermal Interface Material (T412 Tape) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Ideal Use Cases * **Networking Hardware:** Switches and routers where airflow is managed via internal fans. * **Embedded Systems:** Industrial PCs requiring rugged mechanical mounting. * **Power Supplies:** Cooling voltage regulators or power MOSFETs.