The **ATS-01F-135-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Series** | blueICE™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (2-Pin) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 20.00mm | | **Thermal Resistance** | 3.00°C/W @ 200 LFM | | **Airflow** | Vertical (Cross-Cut for omni-directional flow) | --- ### 2. Key Components & Design Features #### A. The Material and Coating * **Aluminum Construction:** Aluminum is used for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** The blue coating is not just for aesthetics; anodizing increases surface emissivity, which improves heat dissipation via radiation and protects the metal from corrosion. #### B. Push-Pin Attachment Mechanism This part uses a **Push-Pin** system with a brass or plastic pin and a spring. * **Pressure:** The spring ensures consistent pressure between the heat sink and the chip. * **Ease of Assembly:** It allows for quick installation into pre-drilled holes on the PCB (Printed Circuit Board). #### C. Cross-Cut Fin Design Unlike straight-fin heat sinks, this model features a **Cross-Cut** pattern. * **Omni-directional Airflow:** It can dissipate heat effectively regardless of the direction the cooling fan is blowing. * **Turbulence:** The gaps between fins create air turbulence, which helps break the "boundary layer" of stagnant air, improving thermal efficiency. --- ### 3. Application Use Cases The ATS-01F-135-C2-R0 is typically found in: 1. **Telecommunications:** Cooling high-speed switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but heat output is high. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators on a motherboard. --- ### 4. Thermal Interface Material (TIM) While the part number refers to the heat sink, these are usually paired with a **Phase Change Material (PCM)** or **Thermal Tape** on the base. For the "C2" variant in the ATS numbering system, it typically implies a specific thermal performance grade or attachment accessory package.