The **ATS-01F-141-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed primarily for thermal management of electronic components like CPUs, GPUs, FPGAs, and power modules. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.90°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **TIM (Thermal Interface Material)** | T412 (Pre-applied) | --- ## 2. Key Electronic Components & Features ### A. The pushPIN™ Attachment System Unlike traditional adhesive-based heat sinks, the "C3" designation refers to a specific push-pin assembly. * **Spring-Loaded:** Provides consistent pressure (clamping force) across the component to ensure optimal heat transfer. * **Mechanical Stability:** Reduces the risk of the heat sink shifting during vibration or shipping. ### B. Fin Design and Airflow The unit features a **straight-fin** or **cross-cut** design (depending on specific sub-variants in the 141 series) optimized for: * **Low Profile (10mm):** Ideal for space-constrained electronic enclosures or 1U server racks. * **Convection:** Designed to work efficiently with both natural convection and forced-air (fan) cooling. ### C. Thermal Interface Material (T412) The part comes pre-applied with **T412**, a high-performance phase-change material. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip. * **Efficiency:** It offers high thermal conductivity while providing electrical insulation to prevent short circuits. --- ## 3. Application Use Cases This specific heat sink is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and high-speed memory modules.