The **ATS-01F-143-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. ### 1. Technical Specifications | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-01F-143-C2-R0 | | **Type** | Top Mount / Board Level | | **Material** | Aluminum | | **Fin Style** | Blue Anodized (Finish) | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### 2. Physical Dimensions This heatsink is designed for a square footprint, optimized for airflow in tight PCB layouts. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height (Fin Depth):** 10.00 mm * **Pin Pitch (Mounting):** 35.00 mm --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the semiconductor junction. Performance varies based on airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **@ 100 LFM (0.5 m/s)** | 7.33 | | **@ 300 LFM (1.5 m/s)** | 4.31 | | **@ 500 LFM (2.5 m/s)** | 3.48 | --- ### 4. Key Electronic Components Features * **Push-Pin Mounting:** Unlike adhesive-based heatsinks, the "pushPIN" system uses a brass or plastic pin with a compressed spring. This provides consistent pressure (TIM - Thermal Interface Material) for better heat transfer and mechanical stability during vibration. * **Material Composition:** Made from high-grade aluminum for lightweight heat dissipation. The **Blue Anodized** finish provides a protective layer against corrosion and slightly improves radiative cooling. * **Cross-Cut Fin Design:** The fins are often designed in a grid or cross-cut pattern. This allows for multi-directional airflow, making it suitable for systems where the fan direction might not be perfectly aligned with the heatsink. --- ### 5. Common Applications * **BGA (Ball Grid Array) Cooling:** Used on processors, FPGAs, and ASICs. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Telecommunications:** Network switches and routers where vertical space (10mm height) is limited.