ATS-01F-152-C1-R0
AI

The **ATS-01F-152-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "blueICE" or "pushPIN" series, designed primarily for cooling Integrated Circuits (ICs) such as CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Plastic Pins & Springs) |
| **Thermal Resistance** | 3.22°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 15mm |
| **Fin Style** | Straight Fin |
| **Weight** | ~15 grams |
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### 2. Breakdown of the Part Number
Electronic manufacturers use a specific nomenclature to identify part variants. For the ATS-01F-152-C1-R0:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **01**: Series designation.
* **F**: Fine pitch fin configuration.
* **152**: Dimensions code (refers to the 35mm size family).
* **C1**: Thermal Interface Material (TIM) type (pre-applied Blue Anodized finish/standard pad).
* **R0**: Revision or packaging code.
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### 3. Electronic Application & Installation
This part is used in electronic assemblies where heat dissipation is critical for component longevity.
#### Mechanical Integration
The `pushPIN™` system allows for:
* **Constant Pressure:** The springs ensure uniform contact between the heat sink and the chip.
* **Tool-less Assembly:** Designed for quick installation on PCBs with pre-drilled holes.
* **Stability:** Higher vibration resistance compared to clip-on or adhesive-only heat sinks.
#### Thermal Management
The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly increases emissivity compared to raw aluminum, assisting in radiation heat transfer.
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### 4. Typical Use Cases
* **Embedded Systems:** Cooling microprocessors in industrial controllers.
* **Networking:** Keeping routers and switch chips within safe operating temperatures.
* **Power Electronics:** Managing heat for voltage regulators and power modules.
- ⤷
What is the hole pattern spacing required for the pushPIN mounting on this heatsink?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
- ⤷ How does the thermal resistance change at higher airflow velocities (LFM)?