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  • ATS-01F-152-C1-R0

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    The **ATS-01F-152-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "blueICE" or "pushPIN" series, designed primarily for cooling Integrated Circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 3.22°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Fin Style** | Straight Fin | | **Weight** | ~15 grams | --- ### 2. Breakdown of the Part Number Electronic manufacturers use a specific nomenclature to identify part variants. For the ATS-01F-152-C1-R0: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01**: Series designation. * **F**: Fine pitch fin configuration. * **152**: Dimensions code (refers to the 35mm size family). * **C1**: Thermal Interface Material (TIM) type (pre-applied Blue Anodized finish/standard pad). * **R0**: Revision or packaging code. --- ### 3. Electronic Application & Installation This part is used in electronic assemblies where heat dissipation is critical for component longevity. #### Mechanical Integration The `pushPIN™` system allows for: * **Constant Pressure:** The springs ensure uniform contact between the heat sink and the chip. * **Tool-less Assembly:** Designed for quick installation on PCBs with pre-drilled holes. * **Stability:** Higher vibration resistance compared to clip-on or adhesive-only heat sinks. #### Thermal Management The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly increases emissivity compared to raw aluminum, assisting in radiation heat transfer. --- ### 4. Typical Use Cases * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Networking:** Keeping routers and switch chips within safe operating temperatures. * **Power Electronics:** Managing heat for voltage regulators and power modules.
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern spacing required for the pushPIN mounting on this heatsink?
    • ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
    • ⤷ How does the thermal resistance change at higher airflow velocities (LFM)?