The **ATS-01F-160-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blueICE™ series and is specifically designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the primary electronic and mechanical properties: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-01F-160-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Attachment Style** | 4-Corner / Cross-cut | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Electronic Features #### A. Heat Dissipation Efficiency The device is designed for **forced air convection**. Its thermal resistance varies significantly depending on the airflow (measured in Linear Feet per Minute - LFM): * **Unducted Airflow:** Efficiently draws heat away from the semiconductor die. * **Fin Design:** Features a "Cross-Cut" pattern which allows for multi-directional airflow, making it versatile for complex PCB layouts where air might not flow in a single straight line. #### B. Thermal Interface Material (TIM) This part comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills the microscopic air gaps between the component (e.g., a processor) and the heat sink base, ensuring maximum thermal conductivity. #### C. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the "C2" designation indicates a **Plastic Push-Pin** with a brass insert or compression spring. * **Reliability:** Provides consistent pressure on the electronic component to ensure optimal thermal contact. * **Safety:** Prevents the heat sink from shifting during vibration or shipping, which is critical for industrial electronics. --- ### 3. Common Applications * **Integrated Circuits (ICs):** BGA (Ball Grid Array) packages. * **Telecommunications:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs and automation controllers. ---