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  • ATS-01F-172-C3-R0

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    The **ATS-01F-172-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30mm x 30mm x 15mm | | **Attachment Method** | Push Pin (with Brass Spring) | | **Thermal Resistance** | 5.82°C/W (at 200 LFM) | | **Fin Style** | XC-CUT (Cross-Cut) | | **Thermal Interface Material** | T412 (Double-Sided Thermal Tape) | --- ### 2. Design and Functional Breakdown #### **XC-CUT Fin Geometry** The "XC-CUT" design refers to a cross-cut pattern in the aluminum fins. Unlike straight-fin heat sinks, this design creates a larger surface area and allows for **omni-directional airflow**. This is crucial in dense electronic enclosures where the direction of the fan's exhaust might not be perfectly aligned with the heat sink. #### **Attachment Mechanism: Push Pins** The part uses a **Push Pin and Spring** assembly. * **Security:** This provides constant pressure (preload) between the heat sink and the component, ensuring maximum heat transfer. * **Ease of Assembly:** It requires pre-drilled holes in the PCB, allowing for quick installation without tools. #### **Thermal Interface Material (TIM)** The **T412** coating is pre-applied to the base. T412 is a high-performance thermal tape that provides strong adhesion while filling microscopic air gaps between the heat sink and the electronic chip to reduce thermal resistance. --- ### 3. Electronic Application Usage This heat sink is typically used in the following electronic environments: 1. **Networking Hardware:** Switches, routers, and modems. 2. **Industrial Controllers:** Cooling power transistors or microcontrollers. 3. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling. ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the optimal 5.82°C/W thermal resistance?
    • ⤷ Does this model come in different heights for low-profile applications?
    • ⤷ How do I calculate the PCB hole spacing required for this push-pin model?