ATS-01F-172-C3-R0
AI

The **ATS-01F-172-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits.
---
### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 30mm x 30mm x 15mm |
| **Attachment Method** | Push Pin (with Brass Spring) |
| **Thermal Resistance** | 5.82°C/W (at 200 LFM) |
| **Fin Style** | XC-CUT (Cross-Cut) |
| **Thermal Interface Material** | T412 (Double-Sided Thermal Tape) |
---
### 2. Design and Functional Breakdown
#### **XC-CUT Fin Geometry**
The "XC-CUT" design refers to a cross-cut pattern in the aluminum fins. Unlike straight-fin heat sinks, this design creates a larger surface area and allows for **omni-directional airflow**. This is crucial in dense electronic enclosures where the direction of the fan's exhaust might not be perfectly aligned with the heat sink.
#### **Attachment Mechanism: Push Pins**
The part uses a **Push Pin and Spring** assembly.
* **Security:** This provides constant pressure (preload) between the heat sink and the component, ensuring maximum heat transfer.
* **Ease of Assembly:** It requires pre-drilled holes in the PCB, allowing for quick installation without tools.
#### **Thermal Interface Material (TIM)**
The **T412** coating is pre-applied to the base. T412 is a high-performance thermal tape that provides strong adhesion while filling microscopic air gaps between the heat sink and the electronic chip to reduce thermal resistance.
---
### 3. Electronic Application Usage
This heat sink is typically used in the following electronic environments:
1. **Networking Hardware:** Switches, routers, and modems.
2. **Industrial Controllers:** Cooling power transistors or microcontrollers.
3. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling.
---
- ⤷
What are the airflow requirements to achieve the optimal 5.82°C/W thermal resistance?
- ⤷ Does this model come in different heights for low-profile applications?
- ⤷ How do I calculate the PCB hole spacing required for this push-pin model?