The **ATS-01F-173-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density cooling requirements. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 30.00 mm x 30.00 mm | | **Height** | 30.00 mm (High Profile) | | **Thermal Resistance** | 4.72°C/W (at 100 LFM) | | **Fin Pattern** | Cross-Cut (Square pins) | --- ### 2. Key Components & Design Features #### A. pushPIN™ Attachment System This part utilizes the **pushPIN™** system, which replaces traditional thermal adhesive tapes. It consists of: * **Compression Springs:** Provide precise pressure to ensure maximum contact with the component (CPU/GPU/FPGA). * **Plastic/Brass Pins:** Secure the heat sink to the PCB through pre-drilled holes. #### B. Cross-Cut Fin Design Unlike straight-fin heat sinks, the **cross-cut** design features vertical gaps between pins. * **Omnidirectional Airflow:** It can receive cooling air from any direction, making it ideal for systems where the airflow path is obstructed or irregular. * **Turbulence:** The pin structure increases air turbulence, which breaks the boundary layer and improves heat dissipation efficiency. #### C. Thermal Interface Material (TIM) The "C3" in the part number typically indicates that the heat sink comes with a **pre-applied thermal interface material**. This ensures low thermal resistance between the component die and the aluminum base. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling: * **ASICs and FPGAs:** High-heat integrated circuits in networking hardware. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Embedded Systems:** Industrial PCs with limited internal space but requiring high-profile cooling. --- ### 4. Part Number Breakdown (Example) The SKU follows a specific nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **01:** Series or style. * **F:** Fin Type (Cross-cut). * **173:** Specific size/footprint code. * **C3:** Thermal Interface Material / Finish code. * **R0:** RoHS Compliance/Revision status.