The **ATS-01F-175-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 13.65 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.07 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Pitch (Hole spacing)** | 40mm | --- ### 2. Key Electronic Components & Design The "Electronic" value of this part lies in its thermal management capabilities. Efficient heat dissipation is critical for maintaining the longevity and performance of semiconductor devices. #### A. Fin Design (XC Cut) The heat sink features a **cross-cut (XC)** fin pattern. This design allows for: * **Multi-directional airflow:** It can receive air from various angles, making it versatile for crowded PCB layouts. * **Increased Surface Area:** Maximizes the area available for heat transfer to the ambient air. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or simple clips, this part uses a precision spring-loaded mechanism: * **Compression Springs:** Provides consistent pressure to ensure optimal contact between the heat sink and the component. * **Plastic/Brass Push Pins:** Designed to lock into pre-drilled holes in the PCB for a secure, vibration-resistant fit. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes with **no thermal interface material pre-applied**, or a specific standard pad. Users typically apply a high-quality thermal paste or pad (like T766) to bridge the microscopic air gaps between the heat sink base and the electronic chip. --- ### 3. Applications This specific model is commonly used in the following electronic sectors: * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs.