The **ATS-01F-176-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions Inc.* and is part of the **pushPIN™** series, designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 10.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 4.40°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01**: Series identifier. * **F**: Fin pitch or attachment type. * **176**: Specific model/size profile. * **C3**: Material/Finish code (Blue Anodized). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Functions While this is a mechanical part, it plays a critical role in the reliability of electronic circuits: * **Heat Dissipation:** It increases the surface area of a heat-generating semiconductor, allowing air to carry away thermal energy more efficiently. * **Thermal Protection:** By maintaining the junction temperature ($T_j$) of a chip below its maximum rating, it prevents thermal throttling and permanent hardware failure. * **Mechanical Stability:** The **pushPIN™** system uses a flexible, spring-loaded mechanism that ensures constant pressure between the heat sink and the chip, optimizing thermal transfer without damaging the PCB. --- ### 4. Application Example This part is commonly used in: * **Embedded Systems:** Industrial PCs where vertical space is limited (10mm height). * **Telecommunications:** Cooling of networking switches or routers. * **Power Supplies:** Dissipating heat from high-power MOSFETs or voltage regulators.