The **ATS-01F-180-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and power modules. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01F-180-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (Off Base)** | 35.00mm | | **Thermal Resistance** | 3.32°C/W @ 200 LFM | | **Fin Style** | Straight Fin | --- ### 2. Key Design Features * **Material (Aluminum):** Provides a balance between lightweight design and high thermal conductivity. The **Blue Anodized** finish increases emissivity and protects the surface from corrosion. * **Push-Pin Attachment:** This model uses a plastic push-pin mechanism with a built-in spring. This ensures a consistent downward pressure (clamping force) on the electronic component, which optimizes the interface with thermal grease or pads. * **Straight Fin Geometry:** Designed for "forced air" environments (airflow from a fan). The straight fins allow air to pass through with minimal pressure drop, effectively carrying heat away from the base. --- ### 3. Thermal Performance Profile Thermal resistance indicates how effectively the heat sink transfers heat to the ambient air. Lower values are better. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | 4.82 | | 200 LFM (1.0 m/s) | 3.32 | | 300 LFM (1.5 m/s) | 2.73 | | 400 LFM (2.0 m/s) | 2.38 | --- ### 4. Integration Requirements To use this part in a PCB design, the following considerations are necessary: 1. **Hole Pattern:** The PCB must have pre-drilled holes matching the push-pin spacing (typically measured diagonally or center-to-center). 2. **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied or requires an external thermal paste to fill microscopic air gaps between the component and the heat sink. 3. **Clearance:** Ensure the 35mm height does not interfere with the enclosure or adjacent tall components (like capacitors).