ATS-01F-21-C2-R0
AI

The **ATS-01F-21-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It falls under the category of **Heat Sinks**, specifically designed for cooling electronic components such as CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The part number itself contains encoded information about its dimensions, material, and thermal properties.
| Feature | Specification |
| :--- | :--- |
| **Type** | Board Level Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimension (L x W)** | 45mm x 45mm |
| **Height** | 10.00mm |
| **Thermal Resistance** | 16.28°C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
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### 2. Functional Breakdown
#### A. Thermal Management
The primary role of this part is to increase the surface area of a heat-generating component (like an Integrated Circuit). By using a **Straight Fin** design, it allows air to pass through the channels, carrying heat away via convection.
#### B. Mounting System (Push-Pins)
The "R0" suffix often refers to the specific attachment kit. This model uses **Push-Pins and Springs**.
- **Efficiency:** The springs ensure constant pressure between the heat sink and the chip.
- **Ease of Use:** It eliminates the need for messy thermal adhesives, though a thermal interface material (TIM) or pad is still required between the surfaces.
#### C. Material and Coating
- **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
- **Blue Anodization:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance.
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### 3. Application Use-Cases
This specific size (45mm) is commonly used in:
* **Networking Equipment:** Routers and switches.
* **Embedded Systems:** Industrial PC motherboards.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
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### 4. Thermal Performance Data
*Measured at different airflow rates (Linear Feet per Minute):*
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural) | 16.28 |
| 300 | 5.01 |
| 500 | 3.32 |
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- ⤷
What is the difference between push-pin and adhesive mounting for this heat sink?
- ⤷ Can this heat sink be used with a custom fan attachment?
- ⤷ How do I calculate if 16.28°C/W is sufficient for my specific chip?