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  • ATS-01F-21-C2-R0

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    The **ATS-01F-21-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It falls under the category of **Heat Sinks**, specifically designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number itself contains encoded information about its dimensions, material, and thermal properties. | Feature | Specification | | :--- | :--- | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 10.00mm | | **Thermal Resistance** | 16.28°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Functional Breakdown #### A. Thermal Management The primary role of this part is to increase the surface area of a heat-generating component (like an Integrated Circuit). By using a **Straight Fin** design, it allows air to pass through the channels, carrying heat away via convection. #### B. Mounting System (Push-Pins) The "R0" suffix often refers to the specific attachment kit. This model uses **Push-Pins and Springs**. - **Efficiency:** The springs ensure constant pressure between the heat sink and the chip. - **Ease of Use:** It eliminates the need for messy thermal adhesives, though a thermal interface material (TIM) or pad is still required between the surfaces. #### C. Material and Coating - **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodization:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance. --- ### 3. Application Use-Cases This specific size (45mm) is commonly used in: * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PC motherboards. * **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 4. Thermal Performance Data *Measured at different airflow rates (Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 16.28 | | 300 | 5.01 | | 500 | 3.32 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and adhesive mounting for this heat sink?
    • ⤷ Can this heat sink be used with a custom fan attachment?
    • ⤷ How do I calculate if 16.28°C/W is sufficient for my specific chip?