The **ATS-01F-31-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Unducted)** | 25.33 °C/W @ 100 LFM | | **Fin Style** | Straight Fin | | **Interface Material** | T412 (Thermal Interface Material pre-applied) | --- ### 2. Design and Construction The "electronic" functionality of this part is purely passive, relying on thermodynamics rather than electricity to operate. * **Straight Fin Design:** The fins are aligned in a parallel row pattern. This design is optimized for environments where there is a consistent, single-direction airflow (forced convection). * **Push-Pin Attachment:** It uses a spring-loaded mechanism that snaps into pre-drilled holes on a Printed Circuit Board (PCB). This ensures constant pressure against the chip for maximum heat transfer. * **T412 Thermal Interface Material (TIM):** The base comes with a pre-applied phase-change material. This fills microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the suffix codes helps identify the specific variant: | Code Segment | Meaning | | :--- | :--- | | **ATS-01** | Manufacturer Series (Advanced Thermal Solutions) | | **F** | Fine Pitch (Fin density) | | **31** | Internal design/Dimension reference | | **C3** | Performance/Finish code (Blue Anodized) | | **R0** | RoHS Compliance Status (Compliant) | --- ### 4. Typical Applications This specific low-profile heat sink (only 10mm high) is ideal for: * **1U/2U Rack Servers:** Where vertical space is extremely limited. * **Embedded Systems:** For industrial PCs or telecommunications equipment. * **Power Electronics:** Cooling MOSFETs or high-speed data converters.