The **ATS-01F-34-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, or power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Top Mount (Heat Sink) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring-loaded) | | **Thermal Resistance** | 14.27°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | --- ### Key Features and Design #### 1. Heat Sink Geometry * **Fin Style:** Straight Fin design. This is optimized for longitudinal airflow. * **Pitch:** The spacing between fins is engineered to minimize pressure drop while maximizing surface area for heat dissipation. #### 2. Mechanical Attachment (pushPIN™) The "R0" at the end of the part number signifies the attachment hardware. This model uses a **push-pin and spring mechanism**: * **Ease of Assembly:** Allows for tool-less or simple installation into pre-drilled PCB holes. * **Consistent Pressure:** The spring ensures a precise amount of force is applied to the component, optimizing the thermal interface material (TIM) performance. #### 3. Thermal Interface Material (TIM) This specific part comes with **no thermal grease pre-applied**, allowing the engineer to choose their own high-performance paste or pad, though some variations in this series include pre-applied T766 phase-change material. #### 4. Material and Finish The use of **Aluminum** provides a lightweight solution with good thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. --- ### Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs or ASICs in telecommunications. * **Power Supplies:** Managing heat in DC-DC converters. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.