The **ATS-01F-35-C1-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it does not contain electronic circuitry (like chips or resistors), it is a critical mechanical component used to manage the thermal profile of electronic semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Top Mount / Fine Pitch | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 22.46°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (Fin Height)** | 10.00mm | --- ### 2. Component Design & Features This heat sink is designed for high-density electronic packaging where space is limited but cooling demands are high. * **Fin Profile (Straight Fin):** The "Fine Pitch" design provides a high surface area to volume ratio, making it efficient for forced-air cooling systems (fans). * **Push-Pin Attachment:** This model uses a brass push-pin mechanism with a specific spring (model-dependent) to ensure consistent pressure between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Thermal Interface Material (TIM):** It typically comes with a pre-applied thermal interface (like ATS-54) to improve heat transfer from the chip to the aluminum fins. --- ### 3. Electronic Application This part is used to protect sensitive electronic components from **Thermal Throttling** or **Catastrophic Failure**. Common applications include: 1. **Telecommunications:** Cooling line cards and routers. 2. **Embedded Computing:** Protecting ARM or x86 processors in industrial PCs. 3. **Power Electronics:** Managing heat for MOSFETs or IGPT modules in compact enclosures. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.46 | | 300 (1.5 m/s) | 10.31 | | 500 (2.5 m/s) | 7.06 | | 700 (3.5 m/s) | 5.67 |