The **ATS-01F-36-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15.00mm | | **Thermal Resistance** | 14.80°C/W (at Natural Convection) | | **Fin Style** | Straight (Extruded) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by ATS to identify the product's attributes: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **01F**: Series designation (typically refers to the fin pattern/attachment type). - **36**: Refers to the footprint size (approx. 36mm). - **C1**: Thermal performance/Material code (Aluminum). - **R0**: Revision or specific packaging code. --- ### 3. Electronic Design Features #### A. Attachment Mechanism The "Push-Pin" system is a critical electronic hardware feature. It uses a flexible, spring-loaded pin that snaps into pre-drilled holes on a Printed Circuit Board (PCB). * **Benefit:** Provides consistent pressure on the electronic chip, ensuring better thermal interface contact than adhesive tapes. #### B. Thermal Performance Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). * **High Airflow:** As the fan speed increases, the resistance drops significantly (e.g., from 14.80°C/W at natural convection down to ~3.0°C/W at high velocity). * **Conductivity:** The blue anodized finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. #### C. Typical Applications This specific size and height (15mm) are commonly used for: * Embedded systems and industrial PCs. * Network switches and routers. * Power modules (MOSFET arrays). --- ### 4. Implementation Example (Mechanical Integration) If you are integrating this into a CAD or PCB layout, the hole spacing is critical: ```markdown PCB Layout Requirements: - Hole Diameter: ~3.0mm (standard for ATS push-pins) - Footprint Area: 37mm x 37mm clearance recommended - Spring Tension: Optimized for 0.125" (3.17mm) thick PCBs ```