The **ATS-01F-38-C3-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). While it is not an active electronic component like an IC or a transistor, it is a critical thermal management part used to cool electronics. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific heat sink model: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.50°C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## 2. Component Features ### A. pushPIN™ Attachment The "R0" suffix refers to the specific attachment mechanism. This model uses a push-pin system with a brass or plastic pin and a stainless steel spring. * **Benefits:** Provides high assembly speed and consistent pressure across the component for better heat transfer. * **Compatibility:** Designed for pre-drilled holes in the PCB. ### B. Fin Design (Straight Fin) This model typically features a straight-fin design. This is optimized for **forced air convection** (fans). The spacing between fins is calculated to minimize pressure drop while maximizing surface area. ### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied to the base. * This is a high-performance phase-change or foil-based material that fills microscopic air gaps between the heat sink and the electronic chip (CPU, GPU, or MOSFET). --- ## 3. Application Use Cases This specific size (40x40mm) is commonly used for cooling the following electronic parts: 1. **BGA Packages:** Large Ball Grid Array chips found in networking equipment. 2. **Processors:** Low-to-mid power CPUs or embedded processors. 3. **Power Electronics:** Large MOSFET arrays or Motor Drivers. 4. **FPGA/ASIC:** High-speed integrated circuits that generate significant heat during operation. --- ### Part Number Breakdown * **ATS:** Advanced Thermal Solutions * **01:** Series number * **F:** Fin style (e.g., Fine pitch) * **38:** Specific dimensions/series code * **C3:** Material/Finish code (Blue Anodized) * **R0:** Revision/Attachment style