The **ATS-01F-45-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, FPGAs, or power transistors. --- ### 1. Technical Specifications The model number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 14.98°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 25.00 mm x 25.00 mm | | **Height (Fin Depth)** | 15.00 mm | | **Pitch / Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Key Components & Features #### A. Fin Design (The "Heat Dissipator") The device utilizes a **cross-cut fin pattern**. Unlike straight fins, cross-cutting allows for multi-directional airflow. This is critical in cramped electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. #### B. Push-Pin Mounting System The suffix `-R0` indicates the mounting hardware. - **Push-Pins:** These are spring-loaded pins that snap into pre-drilled holes on a PCB (Printed Circuit Board). - **Benefit:** It provides consistent pressure on the chip, ensuring optimal contact with thermal interface material (TIM) without the risk of over-tightening. #### C. Material and Coating - **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodized Finish:** Not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiant heat transfer. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-01F-45-C1-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.98 | | 300 (1.5 m/s) | 5.33 | | 500 (2.5 m/s) | 3.80 | | 700 (3.5 m/s) | 3.07 | *Note: Lower °C/W values indicate better cooling performance.* --- ### 4. Application Use Cases 1. **Embedded Systems:** Cooling small-form-factor processors. 2. **Telecommunications:** Dissipating heat from high-speed networking chips. 3. **Power Electronics:** Managing heat for voltage regulators or MOSFETs in industrial power supplies.