The **ATS-01F-47-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-pin (Spring-loaded) | | **Dimensions** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 9.24°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Features #### A. The Fin Profile This model uses a **Straight Fin** design. Straight fins are ideal for environments with high-velocity airflow from a cooling fan. The 30mm height provides a large surface area for heat transfer relative to its small 25mm footprint. #### B. The pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses a mechanical attachment system: * **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink base and the electronic component, maximizing thermal conductivity. --- ### 3. Thermal Performance Data Performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.24 | | 300 (1.5 m/s) | 3.66 | | 500 (2.5 m/s) | 2.58 | | 700 (3.5 m/s) | 2.10 | --- ### 4. Common Applications * **Embedded Systems:** Compact PCs and industrial controllers. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **LED Lighting:** Managing heat for high-output COB LEDs. --- ### 5. Installation Note When installing the ATS-01F-47-C1-R0, it is critical to use a **Thermal Interface Material (TIM)**, such as thermal paste or a phase-change pad, between the heat sink and the chip to eliminate air gaps.