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  • ATS-01F-63-C1-R0

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    The **ATS-01F-63-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimension (Length/Width)** | 40.00 mm x 40.00 mm | | **Height** | 20.00 mm | | **Pitch** | Fine-Pitch | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.29°C/W (Unducted @ 100 LFM) | --- ### 2. Thermal Performance Analysis The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). As airflow increases, thermal resistance decreases significantly: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.29 | | 300 (1.5 m/s) | 3.64 | | 500 (2.5 m/s) | 2.52 | | 700 (3.5 m/s) | 2.05 | --- ### 3. Key Electronic/Mechanical Features * **Fine-Pitch Fin Design:** The "straight fin" geometry provides a large surface area for heat dissipation, making it ideal for systems with high-velocity air cooling. * **PushPIN™ Attachment:** * Utilizes a brass component and a stainless steel spring for secure mounting. * Designed for a **Hole Spacing of 45.00 mm**, ensuring precise alignment over the chip. * **Thermal Interface Material (TIM):** The "R0" suffix indicates that the part typically comes with a pre-applied high-performance thermal pad or grease (specifically **ATS-CPX-404020-63-C1** base type). * **EMI Shielding Compatibility:** The low profile and aluminum construction do not interfere with standard electromagnetic compatibility (EMC) requirements in most PCB layouts. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **01** | PushPIN™ Series designation | | **F** | Fine-Pitch fin type | | **63** | Specific model/dimension ID | | **C1** | Blue Anodized finish | | **R0** | Packaging/Revision indicator |
    ✨ Follow-up Questions
    • ⤷ What are the recommended PCB hole diameters for the pushPIN attachment?
    • ⤷ How does this heat sink compare to cross-cut fin designs for low-airflow environments?
    • ⤷ Can this heat sink be used with a custom thermal interface material?