ATS-01F-63-C1-R0
AI

The **ATS-01F-63-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimension (Length/Width)** | 40.00 mm x 40.00 mm |
| **Height** | 20.00 mm |
| **Pitch** | Fine-Pitch |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 12.29°C/W (Unducted @ 100 LFM) |
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### 2. Thermal Performance Analysis
The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). As airflow increases, thermal resistance decreases significantly:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 12.29 |
| 300 (1.5 m/s) | 3.64 |
| 500 (2.5 m/s) | 2.52 |
| 700 (3.5 m/s) | 2.05 |
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### 3. Key Electronic/Mechanical Features
* **Fine-Pitch Fin Design:** The "straight fin" geometry provides a large surface area for heat dissipation, making it ideal for systems with high-velocity air cooling.
* **PushPIN™ Attachment:**
* Utilizes a brass component and a stainless steel spring for secure mounting.
* Designed for a **Hole Spacing of 45.00 mm**, ensuring precise alignment over the chip.
* **Thermal Interface Material (TIM):** The "R0" suffix indicates that the part typically comes with a pre-applied high-performance thermal pad or grease (specifically **ATS-CPX-404020-63-C1** base type).
* **EMI Shielding Compatibility:** The low profile and aluminum construction do not interfere with standard electromagnetic compatibility (EMC) requirements in most PCB layouts.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **01** | PushPIN™ Series designation |
| **F** | Fine-Pitch fin type |
| **63** | Specific model/dimension ID |
| **C1** | Blue Anodized finish |
| **R0** | Packaging/Revision indicator |
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What are the recommended PCB hole diameters for the pushPIN attachment?
- ⤷ How does this heat sink compare to cross-cut fin designs for low-airflow environments?
- ⤷ Can this heat sink be used with a custom thermal interface material?