The **ATS-01F-76-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 10mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 27.28°C/W (at 100 LFM) | --- ### Key Electronic Components & Design Features #### 1. Heat Sink Body (Thermal Dissipation) The part features a **straight fin** design. In electronics, the fins increase the surface area available for heat transfer to the surrounding air. The aluminum construction provides a high thermal conductivity-to-weight ratio. #### 2. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this part uses a mechanical push-pin system. * **Plastic Push-Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These provide a precise amount of "downward force" (clamping pressure), ensuring the heat sink stays in constant contact with the electronic chip for maximum thermal transfer. #### 3. Blue Anodized Finish The blue coating is not just for aesthetics. Anodization provides: * **Increased Corrosion Resistance:** Protects the aluminum from oxidation. * **Enhanced Emissivity:** Improves the radiative cooling properties of the surface. * **Electrical Insulation:** Adds a thin layer of dielectric protection to prevent short circuits if the sink accidentally touches nearby components. --- ### Thermal Performance Data Thermal resistance indicates how effectively the part removes heat. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 27.28 | | 300 (1.5 m/s) | 13.04 | | 500 (2.5 m/s) | 9.12 | | 700 (3.5 m/s) | 7.42 | --- ### Common Applications * **Embedded Systems:** Cooling small processors in industrial computers. * **Telecommunications:** Managing heat in high-speed networking switches. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.