ATS-01F-77-C1-R0
AI

The **ATS-01F-77-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is designed by Advanced Thermal Solutions (ATS) for the thermal management of integrated circuits (ICs), such as CPUs, GPUs, or power transistors.
### 1. Key Technical Specifications
The following table highlights the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 9.28°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions** | 25mm x 25mm x 20mm |
| **Base Weight** | ~35 grams |
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### 2. Design and Construction
The "electronic" functionality of this part is passive; it facilitates the transfer of heat from an electronic die to the surrounding air to prevent thermal throttling or component failure.
* **Fin Style:** It utilizes a **Straight Fin** design. This is optimized for airflow that moves linearly across the board.
* **Push-Pin Mounting:** The part includes a pre-assembled push-pin and spring mechanism. This ensures consistent pressure between the heat sink and the chip, which is critical for maximizing thermal interface material (TIM) performance.
* **Material Choice:** Aluminum is used for its high thermal conductivity-to-weight ratio, ensuring the component doesn't add excessive mechanical stress to the PCB.
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### 3. Thermal Performance Metrics
Thermal resistance is the most critical metric for this part, measured in Degrees Celsius per Watt (°C/W).
| Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) |
| :--- | :--- | :--- |
| 100 | 4.87°C/W | 9.28°C/W |
| 300 | 2.97°C/W | 4.14°C/W |
| 500 | 2.45°C/W | 3.25°C/W |
---
### 4. Application and Compatibility
This specific model is often used in:
1. **Telecommunications:** Cooling small-form-factor networking chips.
2. **Embedded Systems:** For industrial PCs where space is limited but heat dissipation is high.
3. **Prototyping:** The blue anodized finish provides a protective layer against corrosion, making it suitable for long-term deployments in various environments.
- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ How do I select the correct push-pin size for my PCB thickness?
- ⤷ Does this heat sink come with pre-applied thermal interface material?