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  • ATS-01F-77-C1-R0

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    The **ATS-01F-77-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is designed by Advanced Thermal Solutions (ATS) for the thermal management of integrated circuits (ICs), such as CPUs, GPUs, or power transistors. ### 1. Key Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 9.28°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 25mm x 25mm x 20mm | | **Base Weight** | ~35 grams | --- ### 2. Design and Construction The "electronic" functionality of this part is passive; it facilitates the transfer of heat from an electronic die to the surrounding air to prevent thermal throttling or component failure. * **Fin Style:** It utilizes a **Straight Fin** design. This is optimized for airflow that moves linearly across the board. * **Push-Pin Mounting:** The part includes a pre-assembled push-pin and spring mechanism. This ensures consistent pressure between the heat sink and the chip, which is critical for maximizing thermal interface material (TIM) performance. * **Material Choice:** Aluminum is used for its high thermal conductivity-to-weight ratio, ensuring the component doesn't add excessive mechanical stress to the PCB. --- ### 3. Thermal Performance Metrics Thermal resistance is the most critical metric for this part, measured in Degrees Celsius per Watt (°C/W). | Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 4.87°C/W | 9.28°C/W | | 300 | 2.97°C/W | 4.14°C/W | | 500 | 2.45°C/W | 3.25°C/W | --- ### 4. Application and Compatibility This specific model is often used in: 1. **Telecommunications:** Cooling small-form-factor networking chips. 2. **Embedded Systems:** For industrial PCs where space is limited but heat dissipation is high. 3. **Prototyping:** The blue anodized finish provides a protective layer against corrosion, making it suitable for long-term deployments in various environments.
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ How do I select the correct push-pin size for my PCB thickness?
    • ⤷ Does this heat sink come with pre-applied thermal interface material?