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  • ATS-01F-82-C1-R0

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    The **ATS-01F-82-C1-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an active electronic component like a transistor or IC, it is a critical "electromechanical" or "thermal management" part used to protect electronics from overheating. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Thermal Resistance** | 10.74°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Components The ATS-01F-82-C1-R0 consists of three main physical elements: 1. **Heat Sink Body:** Made of extruded aluminum, which provides high thermal conductivity to draw heat away from the semiconductor. 2. **Push-Pins:** These are the mounting hardware that go through the PCB holes. They are spring-loaded to ensure constant "Down-Force," which maintains a tight interface between the chip and the sink. 3. **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal pad or phase-change material on the base to fill microscopic air gaps between the component and the heat sink. --- ### 3. Electronic Application This part is used to cool integrated circuits (ICs) that generate significant heat during operation. Common target components include: * **BGA (Ball Grid Array) Chips:** Processors, FPGAs, or ASICs. * **Power Management ICs:** Voltage regulators that handle high current. * **Embedded Systems:** Industrial PCs or networking gear (routers/switches). --- ### 4. Part Number Breakdown (Decoding) To understand the "Electronic Parts" aspect, here is how the SKU is constructed: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01:** Attachment type (Push-pin). * **F:** Fin type (Straight). * **82:** Specific design/thermal profile. * **C1:** Material/Finish (Aluminum/Blue Anodized). * **R0:** RoHS compliance status. ---
    ✨ Follow-up Questions
    • ⤷ What is the importance of the push-pin spring force in this heat sink design?
    • ⤷ How does the thermal resistance value change with different airflow speeds?
    • ⤷ Is this heat sink compatible with standard BGA chip sizes?