ATS-01F-82-C1-R0
AI

The **ATS-01F-82-C1-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an active electronic component like a transistor or IC, it is a critical "electromechanical" or "thermal management" part used to protect electronics from overheating.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Dimensions (L x W x H)** | 30mm x 30mm x 25mm |
| **Thermal Resistance** | 10.74°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
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### 2. Physical Design Components
The ATS-01F-82-C1-R0 consists of three main physical elements:
1. **Heat Sink Body:** Made of extruded aluminum, which provides high thermal conductivity to draw heat away from the semiconductor.
2. **Push-Pins:** These are the mounting hardware that go through the PCB holes. They are spring-loaded to ensure constant "Down-Force," which maintains a tight interface between the chip and the sink.
3. **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal pad or phase-change material on the base to fill microscopic air gaps between the component and the heat sink.
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### 3. Electronic Application
This part is used to cool integrated circuits (ICs) that generate significant heat during operation. Common target components include:
* **BGA (Ball Grid Array) Chips:** Processors, FPGAs, or ASICs.
* **Power Management ICs:** Voltage regulators that handle high current.
* **Embedded Systems:** Industrial PCs or networking gear (routers/switches).
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### 4. Part Number Breakdown (Decoding)
To understand the "Electronic Parts" aspect, here is how the SKU is constructed:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01:** Attachment type (Push-pin).
* **F:** Fin type (Straight).
* **82:** Specific design/thermal profile.
* **C1:** Material/Finish (Aluminum/Blue Anodized).
* **R0:** RoHS compliance status.
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- ⤷
What is the importance of the push-pin spring force in this heat sink design?
- ⤷ How does the thermal resistance value change with different airflow speeds?
- ⤷ Is this heat sink compatible with standard BGA chip sizes?