The **ATS-01F-84-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.96° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Straight Fin (Extrusion) | --- ### 2. Design and Component Breakdown #### A. The Fin Profile This heat sink uses a **straight fin** design. Straight fins are ideal for "forced air" environments (where a fan is present) because they allow air to flow linearly through the channels, maximizing the surface area for heat exchange. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized layer increases emissivity and provides a protective barrier against corrosion and electrical conductivity. #### C. Push-Pin Mounting System The "R0" at the end of the part number typically signifies the attachment kit. * **Spring-loaded Push-Pins:** These provide a precise amount of downward pressure (clamping force) on the electronic chip, ensuring an even interface with the thermal paste or pad. * **Ease of Assembly:** It allows for quick installation on a PCB with pre-drilled holes without the need for tools. --- ### 3. Application Use Cases The ATS-01F-84-C1-R0 is commonly used in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial PCs where space is constrained but vertical clearance is available (35mm height). 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data *Measured in °C/W (Degrees Celsius per Watt):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance | | :--- | :--- | :--- | | 100 | 0.5 | 6.96 °C/W | | 300 | 1.5 | 3.42 °C/W | | 500 | 2.5 | 2.62 °C/W |