ATS-01F-86-C1-R0
AI

The **ATS-01F-86-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "push-pin" series designed for board-level component cooling.
### 1. Technical Specifications
Below is a breakdown of the physical and thermal characteristics of this specific component:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm |
| **Fin Style** | Straight Fin |
| **Attachment Type** | Push-Pin (Plastic) |
| **Thermal Resistance** | 17.69° C/W (@ 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
---
### 2. Key Component Features
#### A. The Heat Sink Body
The body is constructed from **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and structural integrity. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection against corrosion and increases emissivity for better radiant heat transfer.
#### B. Attachment Mechanism (Push-Pin)
The "01F" designation indicates the attachment method:
* **Push-Pins:** Plastic pins with integrated springs provide consistent pressure on the heat source.
* **Hole Pattern:** This model requires two pre-drilled holes in the PCB.
* **Springs:** Ensure that the heat sink maintains thermal contact even during vibration or mechanical shock.
#### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766**. This is a thermal grease or pad that fills the microscopic air gaps between the component (CPU, GPU, or ASIC) and the heat sink base, significantly reducing thermal resistance.
---
### 3. Applications
This part is typically used to cool electronic components that generate moderate heat in space-constrained environments:
* **Microprocessors and ASICs**
* **Memory Modules**
* **Network Switches and Routers**
* **Industrial Power Supplies**
---
### 4. Part Number Breakdown
The nomenclature for ATS heat sinks usually follows this logic:
```text
ATS - 01 - F - 86 - C1 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Color/Finish (C1 = Blue Anodized)
| | | +------------ Design Specific ID (Size/Fin configuration)
| | +---------------- Fin Type (F = Fine/Straight)
| +--------------------- Attachment Style (01 = Push-Pin)
+-------------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What are the PCB hole requirements for the ATS-01F-86-C1-R0 push-pins?
- ⤷ How does the thermal resistance of this part change with different airflow (LFM) levels?
- ⤷ What is the difference between the T766 and T412 thermal interface materials used by ATS?