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  • ATS-01F-86-C1-R0

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    The **ATS-01F-86-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "push-pin" series designed for board-level component cooling. ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Fin Style** | Straight Fin | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 17.69° C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Component Features #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and structural integrity. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection against corrosion and increases emissivity for better radiant heat transfer. #### B. Attachment Mechanism (Push-Pin) The "01F" designation indicates the attachment method: * **Push-Pins:** Plastic pins with integrated springs provide consistent pressure on the heat source. * **Hole Pattern:** This model requires two pre-drilled holes in the PCB. * **Springs:** Ensure that the heat sink maintains thermal contact even during vibration or mechanical shock. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a thermal grease or pad that fills the microscopic air gaps between the component (CPU, GPU, or ASIC) and the heat sink base, significantly reducing thermal resistance. --- ### 3. Applications This part is typically used to cool electronic components that generate moderate heat in space-constrained environments: * **Microprocessors and ASICs** * **Memory Modules** * **Network Switches and Routers** * **Industrial Power Supplies** --- ### 4. Part Number Breakdown The nomenclature for ATS heat sinks usually follows this logic: ```text ATS - 01 - F - 86 - C1 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Color/Finish (C1 = Blue Anodized) | | | +------------ Design Specific ID (Size/Fin configuration) | | +---------------- Fin Type (F = Fine/Straight) | +--------------------- Attachment Style (01 = Push-Pin) +-------------------------- Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the ATS-01F-86-C1-R0 push-pins?
    • ⤷ How does the thermal resistance of this part change with different airflow (LFM) levels?
    • ⤷ What is the difference between the T766 and T412 thermal interface materials used by ATS?