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  • ATS-01F-93-C1-R0

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    The **ATS-01F-93-C1-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" product line, designed to optimize airflow and cooling for electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | Push-Pin (with a specific 3.2mm hole size) | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Thermal Resistance** | ~2.50 °C/W (at 200 LFM) | | **Thermal Interface Material** | Pre-applied Phase Change Material (T766) | --- ### 2. Design Characteristics The "93" series within the maxiFLOW line features a unique **flared fin design**. This offers several advantages for electronic cooling: * **Increased Surface Area:** The flared fins provide more area for heat dissipation compared to standard straight-fin heatsinks. * **Pressure Drop Reduction:** The geometry is engineered to reduce the resistance to airflow, allowing fans to work more efficiently. * **Directional Airflow:** It is designed to maximize cooling in environments where there is a clear directional intake of air across the PCB. --- ### 3. Electronic Application This part is typically used to cool high-heat-generating integrated circuits (ICs) such as: 1. **Processors (CPUs/GPUs):** Low-power or embedded processors. 2. **FPGAs & ASICs:** Used in telecommunications and networking equipment. 3. **Power Electronics:** High-speed switching components that require a small footprint but high thermal dissipation. --- ### 4. Part Number Breakdown Understanding the code **ATS-01F-93-C1-R0**: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01F:** Part of the maxiFLOW series. * **93:** Specific fin geometry and height profile. * **C1:** Refers to the thermal interface material (T766) and the attachment type (standard push-pin). * **R0:** Revision code or RoHS compliance indicator.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for ATS heatsinks besides push-pins?
    • ⤷ How do I calculate if the 2.50 °C/W thermal resistance is sufficient for my specific chip?
    • ⤷ What is the benefit of Phase Change Material (T766) over standard thermal grease?