ATS-01F-93-C1-R0
AI

The **ATS-01F-93-C1-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" product line, designed to optimize airflow and cooling for electronic components.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Attachment Method** | Push-Pin (with a specific 3.2mm hole size) |
| **Material** | Aluminum (Black Anodized) |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height** | 20mm |
| **Thermal Resistance** | ~2.50 °C/W (at 200 LFM) |
| **Thermal Interface Material** | Pre-applied Phase Change Material (T766) |
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### 2. Design Characteristics
The "93" series within the maxiFLOW line features a unique **flared fin design**. This offers several advantages for electronic cooling:
* **Increased Surface Area:** The flared fins provide more area for heat dissipation compared to standard straight-fin heatsinks.
* **Pressure Drop Reduction:** The geometry is engineered to reduce the resistance to airflow, allowing fans to work more efficiently.
* **Directional Airflow:** It is designed to maximize cooling in environments where there is a clear directional intake of air across the PCB.
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### 3. Electronic Application
This part is typically used to cool high-heat-generating integrated circuits (ICs) such as:
1. **Processors (CPUs/GPUs):** Low-power or embedded processors.
2. **FPGAs & ASICs:** Used in telecommunications and networking equipment.
3. **Power Electronics:** High-speed switching components that require a small footprint but high thermal dissipation.
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### 4. Part Number Breakdown
Understanding the code **ATS-01F-93-C1-R0**:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01F:** Part of the maxiFLOW series.
* **93:** Specific fin geometry and height profile.
* **C1:** Refers to the thermal interface material (T766) and the attachment type (standard push-pin).
* **R0:** Revision code or RoHS compliance indicator.
- ⤷
What are the alternative attachment methods for ATS heatsinks besides push-pins?
- ⤷ How do I calculate if the 2.50 °C/W thermal resistance is sufficient for my specific chip?
- ⤷ What is the benefit of Phase Change Material (T766) over standard thermal grease?